FA Products

semiconductor analysis

semiconductor failure
Semiconductor Failure Analysis Products

RKD Engineering’s extensive line of sample preparation products allow the Failure Analysis engineer to open plastic packages exposing the die surface and bond wires, thin die for optical back side evaluation and FIB editing, and perform front side de-layering.

Mechanical and chemical decapsulation

The Elite Etch is an acid decapsulator built with 21st Century design concepts. Design innovations have produced the Elite Etch, a tool that encompasses all the functionalities required for decapsulation of plastic IC packages with reproducible results, high throughput and low acid consumption.

Documented field trails confirm Elite Etch consistently outperforms all other commercially available acid decapsulators. Elite Etch process times are always shorter than with other decapsulators, saving both time and money - a key benefit for definitive rapid package evaluation in business sectors including Counterfeit Protection Measures.

The MicroMill is designed to make gaskets and other fixtures for use with RKD Engineering, Nisene and NSC decapsulators. It can also perform mechanical decapsulation and heat spreader removal in preparation for acid decapsulation. It provides an easy to use solution for quick turn decapsulator tooling and device preparation. The MicroMill has a simple, easy to use operator interface making all if its jobs fast and easy to set up and easier to run. Special tooling packages are available that allow for opening ceramic and frit sealed packages.

The NanoMill is designed to make gaskets and other fixtures for use with RKD Engineering, Nisene and NSC decapsulators. It can also perform mechanical decapsulation and heat spreader removal in preparation for acid decapsulation. It provides an
easy to use solution for quick turn decapsulator tooling and device preparation. The NanoMill is controlled by a small touch pad user interface that allows for the operator to select the desired function and enter the key device measurements.

Silicon thinning and polishing

The UltraPrep is a CNC milling machine specifically designed for packaged die thinning and polishing. It is the only system available that can thin warped and bowed die allowing for thin samples with uniform thickness. The UltraPrep is easy to use and contains all functions ever needed to thin packaged die including slurry dispensing pumps and a heated stage for chemical enhanced lapping and polishing.







Sample mounting

The MountPlate provides fast temperature cycling for wax mounting of samples with the temperature and ramp rate control required to eliminate thermal shock, stress, and warpage of the sample being mounted.


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