FA Products

Silicon back side preparation system

Back side thinning and more...

NanoPrep CNC Model 5016

The NanoPrep CNC is designed to perform in package die thinning and polishing along with special machining functions for sample preparation. The die thinned and polished by the NanoPrep CNC are to all back side procedures such as IR emission microscopy and FIB editing. With optional software and hardware, it may make gaskets and other fixtures for use with RKD engineering. Nisene and NSC decapsulators. It can also perform mechanical decapsulation, removal of heat spreaders and heat sinks. It provides and easy to use solution for total back-side device preparation. The NanoPrep is a small, specially designed, CNC machining system controlled by a small hand held user interface that allows for the operator to select the desired function and enter the key device measurements. There is no need to know anything about machining or "G Code" to operate the hand held controller although a computer interface is provided that allows "G Code" programming.

 
NanoPrep CNC Model 5016 by RKD Engineering

Automatic tool touch-down detection and special alignment and leveling functions make setting up on a device fast and easy. Once a device has been processed, all process parameters can be saved as a process recipe. Up to 250 recipes can be saved, each with its own recipe name. A unique fixturing system allows for removing the device being processed for cleaning or inspection without remounting or re-aligning the device. A tilting fixture is provided with the system that allows for fast and accurate leveling. The included digital indicator allows leveling and touch-down accuracies of better than +/-2 microns.

  • Fast, easy set up - Including alignment and leveling
  • Simple operator interface with full process programmability
  • System automation of thinning and polishing processes
  • Programmable depth accurate to +/-5 microns
  • Removable sample holders-allows removal without re-mounting or aligning
  • Compliant tool holder system for grinding, lapping and polishing eliminates "stair stepping" and die cracking
  • Easy removal of heat spreaders, encapsulant, and die attach pad
  • Available and inexpensive tooling
  • Small footprint - takes little bench space
NanoPrep 5016 specifics
 

Specifications

Machine size375mm high, 370mm wide, 330mm deep
Weight20 Kg
Power requirements90 to 250 VAC 49 to 61 Hertz at 4 amps maximum
Interface9 pin "D-sub" serial port to connect to hand held controller
X axis travel75mm
Y axis travel75mm
Z axis travel75mm (57mm with tool installed)
Maximum speed500mm/minute
Resolution5 microns
Positional Accuracy+/- 2.5 microns per millimeter of travel
Spindle axis accuracy+/- 0.67 mill-radians normal to fixture plane
Z axis repeatability+/- 2 microns without re-zero
Maximum spindle speed7,000 RPM
Tool HolderSpecial 3.18mm (.125 inch) shank tool holder (other shank diameters are available on request)
Tool preset height17.78mm

* For more information on this product, go to rkdsystems.org

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